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      • FBM6020 – Full Bridge Module
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PEG-F – Electronic enclosure

An enclosure that meets high requirements

PEG-F: Automotivegehäusemit 18-poligen HDSCS-Stecker nach IP69K mit Elektronik automotive housing
Specification
PEG-F 75-2
PEG-F 98-2
Download
  • environment protection class IP69K according to DIN EN 60529
  • Flame retardant: flame class V-0
    -40 °C to +85 °C
  • Chemical resistance according to ISO 16750-5
  • Compatible with 18-terminal HDSCS connector
  • Width:  85.40 mm
  • Height: 28.05 mm
  • Length: 96.90 mm to 132.40 mm
  • Weight: 61 to 73 g
  • Overall length: 96.9 mm
  • Weight: 61 g
  • Fixing points: 2
  • Overall length: 119.9 mm
  • Weight: 72 g
  • Fixing points: 2
  • Datasheet PEG-F-Enclosure Rev1.7 (en)
  • Ordering and delivery conditions PEG-F-Enclosure (de)
  • 2D Drawing (DXF)
  • 3D Model (STEP)
  • PCB-Lib (Altium)

The electronic enclosure PEG-F is particularly suitable for use in harsh environmental conditions such as in cars, in agricultural or construction machinery. Together with a standard populated and sealed 18-pin HDSCS connector and use of a pressure compensation element (PCE), the housing is dustproof and waterproof and meets the protection class IP69K according to DIN EN 60529.

The enclosure material is flame retardant for increased fire safety requirements according to ISO 60695-11-10.

PEG-F enclosure is proven to be resistant to diesel, biodiesel, urea, cavity protection, preservatives, de-preservatives, windshield cleaners, automotive wash chemicals, glass cleaners, rim cleaners, cold cleaners, ammonia-based cleaners, alcohol and roadway de-icers according to ISO 16750-5.

The temperature range is from -40 °C to 85 °C.

Two internal guide grooves allow the simple insertion of a 1.6 mm thick printed circuit board, which is fixed vibration-proof at the bottom of the enclosure by a constriction. Adhesive surfaces for pressure compensation element and label complete the equipment of the enclosure.

The enclosure is available in 2 different lengths.

For easy and non-destructive disassembly, a release tool is available.

Note: PEG-F replaces the former enclosure PEG.

  • Überblick
  • Elektronik-Gehäuse PEG-F
  • AF10 – PWM Generator
    • HBM II – Halbbrückenmodul für AF10
    • FBM 6020 – Vollbrückenmodul für AF10
  • WRCS III – Weitbereichstromsensor

Ihr Ansprechpartner:

Tobias Hensle: Hardwareentwicklung bei Preis Ingenieurbüro GmbH Preis Ing.

Tobias Hensle
Bachelor of Engineering
(B. Eng.)

Hardwareentwicklung

Telefon | E-Mail

  • Overview
  • PEG-F – Electronic enclosure
  • AF10 – PWM Generator
    • HBM II – Half bridge module for AF10
    • FBM6020 – Full Bridge Module
  • WRCS III – Wide range current sensor

Your contact

Tobias Hensle: Hardwareentwicklung bei Preis Ingenieurbüro GmbH Preis Ing.

Tobias Hensle
Bachelor of Engineering
(B. Eng.)

Hardware development

Phone | E-Mail

Preis Ingenieurbüro GmbH
Hauptstraße 4
77830 Bühlertal

Maito:    info(at)preis-ing.de
Phone:  +49 7223 283131-0

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